Nanolithography using thermal stresses

Thermal Stresses in Microelectronics Subassemblies: Quantitative Characterization Using Photomechanics Methods

Several optical methods for in-situ displacement measurement are presented as a tool to characterize thermomechanical behavior of microelectronics subassemblies. Features and recent developments of the methods are reviewed and applications to diverse problems are illustrated to demonstrate wide applicability of the methods. The whole-field displacement information, with various sensitivity and ...

Accurate Thermal Stresses for Beams: Normal Stress

Formulations for a general theory of thermoelasticity to generate accurate thermal stresses for structural members of aeronautical vehicles were developed in 1954 by Boley. The formulation also provides three normal stresses and a shear stress along the entire length of the beam. The Poisson effect of the lateral and transverse normal stresses on a thermally loaded beam is taken into account in...

A geometric theory of thermal stresses

In this paper we formulate a geometric theory of thermal stresses. Given a temperature distribution, we associate a Riemannian material manifold to the body, with a metric that explicitly depends on the temperature distribution. A change in temperature corresponds to a change in the material metric. In this sense, a temperature change is a concrete example of the so-called referential evolution...

Thermal Stresses in Direct Metal Laser Sintering

In Direct Metal Laser Sintering objects are created by sequential sintering loose metal powder particles by means of laser technology. When the laser sintering process involves temperature gradients, thermal stresses develop. Corresponding residual stresses induce warping of the densified structure leading to unacceptable tolerance losses. This paper examines the role of laser beam scan pattern...

Thermal Stresses in Double-Glazed Windows